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Wafer Laser marking

Bare Si Wafer Grinding/Non-Grinding, Composite, Metal/Polyimide Coating; Soft Beat (Dash) or Hard Punch (White)
Top & bottom CCD, multi-chip wafer precision alignment, marking offset and quality inspection, precise positioning, readable, multiple fonts and sizes adjustable Markable LOGOS and special characters
Marker depth controllable to ensure readability of markup characters on different application materials
Fully automatic precision loading and unloading and conveying system
. The marking process has zero contact on the surface of the product. Compatible with 8-inch and 12-inch wafers, 12" ports with 8" adapters for fast switching of wafers of different sizes
Precise positioning, readability, adjustable fonts and sizes /> FFC platform loading, support for thinner or warped wafers, top fixture mounting & bottom vacuum adsorption to minimize wafer warpage OCR (Optical Character Recognition) Read and SECS/GEM functions, laser mark after downloading the wafer mapping file

Contact Us

  • Shenzhen Teyan Semiconductor Equipment Co., Ltd.  
    Contact: Mr. Cheng
    Tel:0755-23216715
    Address: Unit 203, Building C, Building 5, Chuangwei Innovation Valley, No.1 Tangtou, Shiyan Street, Baoan District, Shenzhen  


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